Dr. SANJAY JHA
Chairman of the Board CEO of GLOBALFOUNDRIES Inc.
Dr. Sanjay Jha is Chief Executive Officer of GLOBALFOUNDRIES Inc. Prior to GlOBALFOUNDRIES, he was the chairman and chief executive officer of Motorola Mobility and previously served as the co-chief executive officer of Motorola. Before joining Motorola, Sanjay Jha was COO of Qualcomm and president of Qualcomm CDMA Technologies. As COO, Jha was overlooking Corporate Research and Development and Qualcomm Flarion Technologies (QFT) in addition to his role as president of QCT, the chipset and software division of Qualcomm Incorporated. Prior to Qualcomm, he held various engineering roles at Brooktree Corporation and Hirst Research Centre.
Jha served two prominent industry roles in addition to his leadership at Qualcomm. In June 2005, he was elected to the board of directors of the Semiconductor Industry Association. He also served as chairman of the Fabless Semiconductor Association. Dr.Jha has a Ph.D. in electronic and electrical engineering from the University of Strathclyde and a B.S. in engineering from the University of Liverpool.
Alain Mutricy is the SVP, Product Management Group, at GLOBALFOUNDRIES. Assuming the role in 2016, he is responsible for leading the Product Management, Program Management, Strategic Marketing and Design Enablement organizations.Alain is an accomplished senior executive with more than 25 years of experience in general business management and complex technology product line management in the consumer electronics, mobile, and semiconductor industries.
Prior to his current role, Alain served as Founder-Consultant, Executive Adviser, for AxINNOVACTION, a company that promotes action to unlock and accelerate innovation in big organizations and proposes a customized strategy framework to develop new products.Alain has also held the roles of Co-Founder and CEO, at Vuezr, Inc.; Senior Vice President, Portfolio and Product Management, and Senior Vice President, Motorola Handsets Platform Technology, at Motorola Mobile Devices; and Vice President at Texas Instruments, leading the cellular chipsets and OMAP organizations.Alain holds an MBA, Cum Laude, from the HEC Group in Paris, France, and a Masters Degree in Mechanical and Electrical Engineering from A&M Paris-Tech. Alain is also a founding member of the MIPI alliance, an early Director of Open Mobile Alliance, and was Board member of UIQ AB.
Vice President at GlobalFoundries
Derek Jensen is a Vice President at GlobalFoundries, where he heads the Corporate Development and M&A effort. Prior to GlobalFoundries, he previously served as Vice President, Corporate Development of Tessera Technologies, a leader in semiconductor packaging, interconnect, and computational imaging solutions. Derek spent 10 years with leading investment banking firms, including Deutsche Bank, Citigroup, and UBS in San Francisco and London where he focused on M&A and corporate finance transactions in the semiconductor and electronics sectors. Derek also brings several years of experience in intellectual property acquisition and licensing. Derek began his career at Motorola, where he worked as a wireless handset engineer on early GSM and 3G handsets.
Derek holds an MBA with High Honors from the University of Chicago Booth School of Business, and Master’s and Bachelor’s degrees in Mechanical Engineering from the University of Illinois, Chicago, and the University of Minnesota, respectively.
DUEN-CHIAN (DC) CHENG
President UMC Capital Corporation.
Duen-Chian (DC) Cheng has been the President of UMC Capital Corporation since 2003. He is responsible for the firm’s investment strategy, team, and operations across all worldwide offices. Mr. Cheng has led the firm to successfully complete more than 20 IPOs and 50 M&As, many of which he served directorship. Mr. Cheng concurrently serves as Chairman at Clientron Corporation, Director at Touchmedia International Holdings, Independent Board of Director at Edom Technology, Independent Board of Director at Ta Ya Electric Wire & Cable Co. Ltd., and Venture Partner at Translink Capital.
Mr. Cheng has over 25 years of experience in the financial industry and has held various management roles. Prior to UMC Capital, he was the Managing Director of United Investment. From 1995 to 2000, he was Executive Director of the Investment Banking Division and General Manager of the Taiwan Branch at Morgan Stanley Asia L.L.C. He was responsible for major projects such as the GDR issuance of ASE Inc., IPO of ASE Test, Inc., and the issuance of $1.3B USD ADR of UMC. From 1993 to 1995, Mr. Cheng served as the Vice President of Morgan Stanley Hong Kong. Prior to Morgan Stanley, Mr. Cheng served as the Executive Director of the Equities Division at Goldman Sachs Asia L.L.C.
Mr. Cheng received his MBA from Columbia Business School and a BS in Banking and Finance from National Taiwan University.
Managing Director WALDEN International USA
Andrew joined Walden International in 1994. Prior to WI, he was President of Chemical Technologies Ventures. He was also a management consultant at Strategic Planning Associates and Booz, Allen and Hamilton. Earlier in his career, he was a research scientist at Systems Planning Corporation and a VLSI semiconductor engineer at IBM.
Andrew holds a BS in Electrical Engineering from Brown University and an MBA from the University of Virginia.
GUDE DASARADHA (GD)
Co-founder and Board Member
GD has a long & successful track record as a serial entrepreneur leading multiple startup companies like Cute Solutions (acquired by ATI technologies), Virtual IP Group, Qualcore Logic, Pacific Semiconductors (acquired by Faraday) etc. He was most recently Corporate VP at AMD and was responsible for multiple engineering teams in various product areas like CPUs, GPUs and consumer devices. As Managing Director for AMD India, he created a world-class team of 1200 engineers and led the development of industry first fusion SOC. During the earlier part of his career, he worked at SMOS and Epson. He was recognized as one of the “Game Changers” in Indian technology industry by Times of India. He was the organizing chair of VLSI conference in 2006 & 2008 and is a well-known speaker at various industry forums. He obtained the “Best-Run Company Award” for AMD by HYSEA during 2007 to 2009. GD has a Bachelor’s degree in Electrical & Electronics Engineering from Jawaharlal Nehru Technological University, A.P, India and a Diploma in Systems Management from Jamnalal Institute of Management, Mumbai, India.
Krishna has over 20 years experience in Microprocessor, DSP and system architecture/design and was CEO of Hellosoft before it was acquired by Imagination Technologies in 2010. Krishna was involved in several successful companies including Sun, ZSP, vEngines, SiliconSpice, Intoto, Chiplogic, and eSilicon in Silicon Valley. Krishna has been recognized as a “Technology Pioneer” by the World Economic Forum in Davos. Prior to starting HelloSoft, Krishna was Chairman, President & CEO of ZSP, where he pioneered the development of DSP’s based on RISC technology. ZSP was acquired by LSI Logic, and it’s industry leading DSP architecture has been adopted by major semiconductor companies including Broadcom, IBM, Conexant, GlobespanVirata, Skyworks, Yamaha and PMC-Sierra. A seasoned entrepreneur, Krishna has been involved with several successful companies as investor, advisor or board member – nBand (acquired by Proxim), a communications processor company, Silicon Spice (acquired by Broadcom), vEngines (acquired by Centillium), Intoto (acquired by Freescale), Valyd (acquired by EMC) and eSilicon. Krishna held key management and technical positions in the SPARC processor division of Sun Microsystems and was a key player in successful launch of four SPARC processors (UltraSPARC I & II, SuperSPARC I & II). Krishna is a frequently invited speaker on DSP architecture and technology, and a contributor on DSP to industry journals such as Microprocessor report, Computer design, and EEtimes. Krishna has a B.S and MS in Electrical Engineering.
Founder & CEO
Balaji founded Ineda Systems and serves as our Chief Executive Officer. Prior to his current role, he held the role of CTO & head of engineering to build a 100+ strong R&D team and led the development of foundation IO-V technology and industry first hierarchical computing architecture. Before Ineda, he was at AMD where he was responsible for management of 500+ engineer organization and was also program executive for their low power fusion SOC. Prior to AMD, he worked at Conexant Systems as a Senior Director managing their Set-Top-Box and Imaging/PC Media silicon engineering teams. He also worked in technical/management roles at Silicon Valley startups Ikanos & Velio and was a key member of their industry first networking/communication products. Earlier in his career, he was associated with Intel towards their x86 CPU and mobile chip-set engineering product development. He has filed for 20+ patents till date and played the role of a technical advisor for few Silicon Valley startups. He has a Masters degree in Electrical Engineering from Arizona State University.