Chairman of the Board CEO of GLOBALFOUNDRIES Inc.

Dr. Sanjay Jha is Chief Executive Officer of GLOBALFOUNDRIES Inc. Prior to GlOBALFOUNDRIES, he was the chairman and chief executive officer of Motorola Mobility and previously served as the co-chief executive officer of Motorola. Before joining Motorola, Sanjay Jha was COO of Qualcomm and president of Qualcomm CDMA Technologies. As COO, Jha was overlooking Corporate Research and Development and Qualcomm Flarion Technologies (QFT) in addition to his role as president of QCT, the chipset and software division of Qualcomm Incorporated. Prior to Qualcomm, he held various engineering roles at Brooktree Corporation and Hirst Research Centre.

Jha served two prominent industry roles in addition to his leadership at Qualcomm. In June 2005, he was elected to the board of directors of the Semiconductor Industry Association. He also served as chairman of the Fabless Semiconductor Association. Dr.Jha has a Ph.D. in electronic and electrical engineering from the University of Strathclyde and a B.S. in engineering from the University of Liverpool.



President UMC Capital Corporation.

Duen-Chian (DC) Cheng has been the President of UMC Capital Corporation since 2003. He is responsible for the firm’s investment strategy, team, and operations across all worldwide offices. Mr. Cheng has led the firm to successfully complete more than 20 IPOs and 50 M&As, many of which he served directorship. Mr. Cheng concurrently serves as Chairman at Clientron Corporation, Director at Touchmedia International Holdings, Independent Board of Director at Edom Technology, Independent Board of Director at Ta Ya Electric Wire & Cable Co. Ltd., and Venture Partner at Translink Capital.

Mr. Cheng has over 25 years of experience in the financial industry and has held various management roles. Prior to UMC Capital, he was the Managing Director of United Investment. From 1995 to 2000, he was Executive Director of the Investment Banking Division and General Manager of the Taiwan Branch at Morgan Stanley Asia L.L.C. He was responsible for major projects such as the GDR issuance of ASE Inc., IPO of ASE Test, Inc., and the issuance of $1.3B USD ADR of UMC. From 1993 to 1995, Mr. Cheng served as the Vice President of Morgan Stanley Hong Kong. Prior to Morgan Stanley, Mr. Cheng served as the Executive Director of the Equities Division at Goldman Sachs Asia L.L.C.

Mr. Cheng received his MBA from Columbia Business School and a BS in Banking and Finance from National Taiwan University.


President and Chief Executive Officer Cadence Design Systems, Inc

Lip-Bu Tan is Founder and Chairman of Walden International, a leading venture capital firm managing over $2.3 billion in committed capital. He concurrently serves as President and Chief Executive Officer of Cadence Design Systems, Inc., and has been a member of the Cadence Board of Directors since 2004. He currently serves on the Board of Ambarella Inc. (NASDAQ: AMBA), Semiconductor Manufacturing International Corp. (NYSE: SMI; HKSE: 981), Hewlett Packard Enterprise (NYSE:  HPQ), and previously served on the Boards of Inphi Corporation (NYSE: IPHI), Flextronics International (NASDAQ: FLEX), SINA (NASDAQ:  SINA), and MindTree Ltd. (IN: MTCL). Lip-Bu invests primarily in industries relating to semiconductor/components, alternative energy, and digital media. Lip-Bu received his B.S. from Nanyang University in Singapore, his M.S. in Nuclear Engineering from the Massachusetts Institute of Technology, and his MBA from the University of San Francisco. Additionally, Lip-Bu serves on the Board of Trustees and the School of Engineering Dean’s Council at Carnegie Mellon University (CMU), the School of Engineering Dean’s Advisory Board at the Massachusetts Institute of Technology (MIT), the College of Engineering Advisory Board at University of California Berkeley, the Board of Directors of the Global Semiconductor Alliance (GSA), and on the Board of Directors of United Overseas Bank (UOB) in Singapore. He also served as a Trustee of Nanyang Technological University (NTU) in Singapore from 2006 to 2011, and a member of the Regent College Board of Governors from 2006 to 2012. Lip-Bu has been ranked amongst the Top 10 Venture Capitalists in China by Zero2ipo and the Top 50 Venture Capitalists on the Forbes Midas List.


Executive Vice President, Finance and Operations, Imagination Technologies Inc.

Krishna Raghavan is Executive Vice President, Finance and Operations of Imagination Technologies.  He is responsible for Business Operations for the V.VoIP business and has grown the business across multiple geographies where customers have successfully shipped several tens of millions of units with IP from Imagination. In addition to his P&L responsibility on the V.VoIP business he manages Finance and Operations for Imagination Americas, India and China. He brings 25 years of Business experience in all areas of Finance and Operations and has been associated with various mergers and acquisition of businesses at Imagination to deliver long term growth and strategy.

His background includes extensive public accounting (A. F. Ferguson and Co, affiliates of KPMG) and major corporate experience with industry specialization in health care technology, telecommunications, biotechnology and Information technology.

Imagination is a global technology leader whose products touch the lives of billions of people throughout the world. The company’s broad range of silicon IP (intellectual property) includes the key processing blocks needed to create the SoCs (Systems on Chips) that power all mobile, consumer and embedded electronics. Its unique software IP, infrastructure technologies and system solutions enable its customers to get to market quickly with complete and highly differentiated SoC platforms. Imagination’s licensees include many of the world’s leading semiconductor manufacturers, network operators and OEMs/ODMs who are creating some of the world’s most iconic products.

Prior to Imagination, Krishna co-founded health care start- ups DermEbx and Radion, Inc. that were successfully acquired and also has held CFO positions with Hellosoft and ZSP, Inc where he has been involved with the entire life cycle of start to exit including fund raising from seed to venture funds.

He is currently on the Board of Ineda Systems. 


Founder and Board Member

GD has a long & successful track record as a serial entrepreneur leading multiple startup companies like Cute Solutions (acquired by ATI technologies), Virtual IP Group, Qualcore Logic, Pacific Semiconductors (acquired by Faraday) etc. He was most recently Corporate VP at AMD and was responsible for multiple engineering teams in various product areas like CPUs, GPUs and consumer devices. As Managing Director for AMD India, he created a world-class team of 1200 engineers and led the development of industry first fusion SOC. During the earlier part of his career, he worked at SMOS and Epson. He was recognized as one of the “Game Changers” in Indian technology industry by Times of India. He was the organizing chair of VLSI conference in 2006 & 2008 and is a well-known speaker at various industry forums. He obtained the “Best-Run Company Award” for AMD by HYSEA during 2007 to 2009. GD has a Bachelor’s degree in Electrical & Electronics Engineering from Jawaharlal Nehru Technological University, A.P, India and a Diploma in Systems Management from Jamnalal Institute of Management, Mumbai, India.


Founder & CEO

Balaji founded Ineda Systems and serves as our Chief Executive Officer. Prior to his current role, he held the role of CTO & head of engineering to build a 100+ strong R&D team and led the development of foundation IO-V technology and industry first hierarchical computing architecture. Before Ineda, he was at AMD where he was responsible for management of 500+ engineer organization and was also program executive for their low power fusion SOC. Prior to AMD, he worked at Conexant Systems as a Senior Director managing their Set-Top-Box and Imaging/PC Media silicon engineering teams. He also worked in technical/management roles at Silicon Valley startups Ikanos & Velio and was a key member of their industry first networking/communication products. Earlier in his career, he was associated with Intel towards their x86 CPU and mobile chip-set engineering product development. He has filed for 20+ patents till date and played the role of a technical advisor for few Silicon Valley startups. He has a Masters degree in Electrical Engineering from Arizona State University.

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